Mr. Ehsanul Islam is an accomplished Vice President of Engineering at Qualcomm, a leading global semiconductor and telecommunications equipment company. In his role, Mr. Islam is responsible for overseeing customer engineering teams in Taiwan and Southeast Asia, including hardware, software, and technical account management teams. Additionally, he serves as the Regional Head of Qualcomm SEA, where he is accountable for managing all business development and marketing activities across the SEA region.
Before joining Qualcomm in 2013, Mr. Islam held executive-level positions at PacketVideo, a sister company of NTT DoCoMo, and Vodafone Japan, where he gained extensive experience in program management and defining and managing product roadmaps for multimedia software and mobile platforms for high-end smartphones. From 2009, he served as the Managing Director of PacketVideo India, where he was responsible for building a high-quality engineering team for new multimedia software development, including product definition and rollouts, as well as strategic customer engagement and alignment.
Mr. Islam's career spans several other notable companies, including Motorola/Freescale Semiconductor and Agilent Technologies, where he held application engineering positions and focused primarily on wireless communications. He holds a Bachelor's and Master's degree in Electronics Engineering from the prestigious Tokyo University of Electro-Communications, as well as an MBA in International Business from Tsukuba University in Japan.
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